Reliability Analysis for Multiple Dependent Failure Processes: An MEMS Application
Volume 6, Number 1, January 2010 - Paper SC18 - pp. 100-102
QIANMEI FENG1 and DAVID W. COIT21Department of Industrial Engineering, University of Houston, Houston, TX, USA
2Department of Industrial & Systems Engineering, Rutgers University, Piscataway, NJ, US
(Received on March 23, 2009, revised on May 26, 2009)
Widespread acceptance of micro-electro-mechanical systems (MEMS) depends highly on their reliability, both for large-volume commercialization and for critical applications. The problem of multiple dependent failure processes is of particular interest to MEMS researchers. For MEMS devices subjected to both wear degradation and random shocks that are dependent and competing, we propose a new reliability model based on the combination of random-shock and degradation modeling. The models developed in this research can be applied directly or customized for most current and evolving MEMS designs with multiple dependent failure processes.
Click here to download the paper.
Please note : You will need Adobe Acrobat viewer to view the full articles.