Reliability of PBGA Solder Joints under Random Vibration Load

doi:10.23940/ijpe.20.10.p13.16171626

Int J Performability Eng ›› 2020, Vol. 16 ›› Issue (10): 1617-1626.doi: 10.23940/ijpe.20.10.p13.16171626

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Reliability of PBGA Solder Joints under Random Vibration Load

Jiang Shao^a,* and Tong An^b

^aChina Aero-Polytechnology Establishment, Beijing, 100028, China;
^bBeijing University of Technology, Beijing, 100124, China

Submitted on ; Revised on ; Accepted on
Contact: * E-mail address: saviola80@sina.com
About author:Jiang Shao is a senior engineer of China Aero-Polytechnology Establishment. His research interests include reliability engineering and physics of failure of electronic and mechanical products.

Abstract

Abstract: Reliability test and finite element analysis have been conducted to study the reliability of PBGA (Plastic Ball Grid Array Package) under random vibration load. Firstly, random vibration tests with various levels of excitation were conducted on the PBGA PCB (Printed Circuit Board) samples; the resistances of the components are monitored on real time, and a two-parameter Weibull distribution model was used to analyze the test results. Thus, the failure time was acquired. Secondly, finite element analysis was conducted on the 3D model of the test samples in order to ensure the model accuracy. Frequency and displacement were measured to compare the analysis results, and the vibration fatigue life was calculated based on Steinberg model. Lastly, by comparing the test results and the analysis results, Steinberg model is modified to ensure the prediction error of vibration fatigue model of PBGA package is less than 70%, which proves the random vibration fatigue model has good precision in engineering.

Key words: PBGA, random vibration, finite element analysis, fatigue prediction

Jiang Shao and Tong An. Reliability of PBGA Solder Joints under Random Vibration Load [J]. Int J Performability Eng, 2020, 16(10): 1617-1626.

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Reliability of PBGA Solder Joints under Random Vibration Load

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