Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via(TSV)

Chen Yuan,Zhang Peng,Xia Kuiliang,Huang Hongzhong

Table 1 Thickness data of the boundary layers of S3

Point Cu seed layer($\text{ }\!\!\mu\!\!\text{ m}$) Parylene layer($\text{ }\!\!\mu\!\!\text{ m}$) SiO2 layer($\text{ }\!\!\mu\!\!\text{ m}$) Point 1 2.89 1.13 2.30 Point 2 2.34 0.99 1.94 Point 3 1.56 0.85 1.18 Point 4 1.27 1.02 1.00 Point 5 0.47 0.99 0.39 Point 6 0.68 0.97 0.33 Point 7 0.80 0.76 0.36 Point 8 0.71 0.86 0.42 Point 9 1.11 0.71 0.37 Point 10 0.38 1.17 0.52 Point 11 0.76 1.12 0.85 Point 12 0.77 1.33 1.20 Point 13 0.99 0.85 1.67 Point 14 1.85 1.09 2.06 Point 15 2.99 1.21 2.12 Average value 1.30 1.00 1.11 Mean square error 0.82 0.17 0.71