Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via(TSV)

Chen Yuan,Zhang Peng,Xia Kuiliang,Huang Hongzhong

Table 2 Thickness data of the copper seed layer of different vias

Via No. S3 S5 S8 C3 C5 C8 Diameter/Side length($\text{ }\!\!\mu\!\!\text{ m}$) 79.6 71.1 48.6 78.6 67.6 46.2 Depth($\text{ }\!\!\mu\!\!\text{ m}$) 120.0 122.8 115.3 115.0 115.5 111.2 Aspect ratio 1.5 1.7 2.3 1.5 1.7 2.4 Average value($\text{ }\!\!\mu\!\!\text{ m}$) 1.31 1.26 1.07 1.12 1.07 0.98 Mean square error($\text{ }\!\!\mu\!\!\text{ m}$) 0.823 0.855 0.870 0.823 0.945 0.995